Effects of thermal annealing on structure, morphology and...

Solid-State Electronics 2010 Vol. 54; Iss. 7

Effects of thermal annealing on structure, morphology and electrical properties of F16CuPc/α6T heterojunction thin films

Rongbin Ye, Mamoru Baba, Koji Ohta, Kazunori Suzuki
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Volume:
54
Year:
2010
Language:
english
Pages:
5
DOI:
10.1016/j.sse.2010.03.014
File:
PDF, 922 KB
english, 2010
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