Post-Etch Cleaning Chemistries Evaluation for Low k-Copper...

Solid State Phenomena 2003 Vol. 92

Post-Etch Cleaning Chemistries Evaluation for Low k-Copper Integration

Broussous, Lucile, Hinsinger, O., Favier, Sylvie, Besson, Pascal
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Volume:
92
Year:
2003
Journal:
Solid State Phenomena
DOI:
10.4028/www.scientific.net/SSP.92.263
File:
PDF, 428 KB
2003
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