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Borderless via Clean Study for Minimizing Al-Cu Loss in 58nm Flash Devices
Chen, Cheng Kuen, Yu, Pi Chun, Lee, Ming Hsiu, Wu, Chih Ning, Matsuo, HiroshiVolume:
145-146
Year:
2009
Language:
english
Journal:
Solid State Phenomena
DOI:
10.4028/www.scientific.net/SSP.145-146.357
File:
PDF, 1.22 MB
english, 2009