Volume 145-146

Solid State Phenomena

Volume 145-146
1

Cu Dendrite Formation in Post Trench Etch Cleaning

Year:
2009
Language:
english
File:
PDF, 574 KB
english, 2009
5

Evaluation of Plasma Strip Induced Substrate Damage

Year:
2009
Language:
english
File:
PDF, 243 KB
english, 2009
15

A Novel Vapor Phase Etching Process for Si

Year:
2009
Language:
english
File:
PDF, 10.73 MB
english, 2009
17

Design and Development of Novel Remover for Cu/Porous Low-k Interconnects

Year:
2009
Language:
english
File:
PDF, 1.84 MB
english, 2009
18

Reduced Particle Removal Efficiency Upon Wafer Storage

Year:
2009
Language:
english
File:
PDF, 628 KB
english, 2009
20

Trace Metallic Contamination Analysis on Wafer Edge and Bevel by TXRF and VPD-TXRF

Year:
2009
Language:
english
File:
PDF, 546 KB
english, 2009
43

A Novel Copper Interconnection Cleaning by Atomic Hydrogen Using Diluted Hydrogen Gas

Year:
2009
Language:
english
File:
PDF, 2.03 MB
english, 2009
48

Impact of Metal-Ion Contaminated Silica Particles on Gate Oxide Integrity

Year:
2009
Language:
english
File:
PDF, 999 KB
english, 2009
54

Cleanliness Management in Advanced Microelectronic

Year:
2009
Language:
english
File:
PDF, 330 KB
english, 2009
61

Recyclable Fluorine-Based Cleaning Solvents for Resist Removal

Year:
2009
Language:
english
File:
PDF, 337 KB
english, 2009
63

Megasonic Sweeping and Silicon Wafer Cleaning

Year:
2009
Language:
english
File:
PDF, 729 KB
english, 2009
65

Co-Solvent Effect on the HF/CO2 Dry Etching of Sacrificial Oxides

Year:
2009
Language:
english
File:
PDF, 359 KB
english, 2009
78

Impacts of Ionization Potentials and Megasonic Dispersion

Year:
2009
Language:
english
File:
PDF, 461 KB
english, 2009