![](/img/cover-not-exists.png)
Thermoelectric-powered convective cooling of microprocessors
Yazawa, K., Solbrekken, G.L., Bar-Cohen, A.Volume:
28
Language:
english
Journal:
IEEE Transactions on Advanced Packaging
DOI:
10.1109/tadvp.2005.846854
Date:
May, 2005
File:
PDF, 608 KB
english, 2005