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Effect of post-reflow cooling rate on intermetallic compound formation between Sn–3.5 Ag solder and Ni–P under bump metallization
Min He, Zhong Chen, Guojun Qi, C.C. Wong, S.G. MhaisalkarVolume:
462-463
Year:
2004
Language:
english
Pages:
7
DOI:
10.1016/j.tsf.2004.05.045
File:
PDF, 1.14 MB
english, 2004