Volume 462-463; Issue none

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Thin Solid Films
Volume 462-463; Issue none

Thin Solid Films

Volume 462-463; Issue none

1

The decomposition mechanism of SiO2 with the deposition of oxygen-deficient M(Hf or Zr)Ox films

Q. Li, S.J. Wang, P.C. Lim, J.W. Chai, A.C.H. Huan, C.K. Ong

Journal:

Thin Solid Films

Year:

2004

Language:

english

File:

PDF, 377 KB

english, 2004

2

ALD (HfO2)x(Al2O3)1−x high-k gate dielectrics for advanced MOS devices application

H.Y. Yu, M.F. Li, D.L. Kwong

Journal:

Thin Solid Films

Year:

2004

Language:

english

File:

PDF, 522 KB

english, 2004

3

Photoemission study of high-k praseodymium silicates formed by annealing of ultrathin Pr2O3 on SiO2/Si

Z.M. Wang, J.X. Wu, Q. Fang, J.-Y. Zhang

Journal:

Thin Solid Films

Year:

2004

Language:

english

File:

PDF, 636 KB

english, 2004

4

Effect of substrate on phase transformation kinetics of WSix films

S. Bharat, P.K. Sahoo, M. Katiyar

Journal:

Thin Solid Films

Year:

2004

Language:

english

File:

PDF, 410 KB

english, 2004

5

Interfacial reactions and mechanism of C54 TiSi2 phase formation enhanced by multi-thermal-shock method

S. Li, H.S. Park, C.Q. Sun, S. Widjaja, K. Liao

Journal:

Thin Solid Films

Year:

2004

Language:

english

File:

PDF, 752 KB

english, 2004

6

A new measurement technique for the characterization of carrier lifetime in thin SOI MOSFETs

Yoshikata Nakajima, Hideki Tomita, Kenichi Aoto, Kenji Sasaki, Tatsuro Hanajiri, Toru Toyabe, Takitaro Morikawa, Takuo Sugano

Journal:

Thin Solid Films

Year:

2004

Language:

english

File:

PDF, 461 KB

english, 2004

7

Channel mobility degradation and charge trapping in high-k/metal gate NMOSFETs

Shajan Mathew, L.K. Bera, N. Balasubramanian, M.S. Joo, B.J. Cho

Journal:

Thin Solid Films

Year:

2004

Language:

english

File:

PDF, 184 KB

english, 2004

8

Effect of processing parameters on electroless Cu seed layer properties

Y.C. Ee, Z. Chen, L. Chan, Alex K.H. See, S.B. Law, K.C. Tee, K.Y. Zeng, L. Shen

Journal:

Thin Solid Films

Year:

2004

Language:

english

File:

PDF, 787 KB

english, 2004

9

Deep trench etch and clean process technology for CU/SiOC passive device

M.B. Yu, V.N. Bliznetsov, C.K. Chang, B. Ramana Murthy

Journal:

Thin Solid Films

Year:

2004

Language:

english

File:

PDF, 256 KB

english, 2004

10

Effect of oxygen pressure and laser fluence during pulsed laser deposition of TiO2 on MTOS (Metal–TiO2–SiO2–Si) capacitor characteristics

Roy Paily, Amitava DasGupta, Nandita DasGupta, Tapas Ganguli, Lalit M. Kukreja

Journal:

Thin Solid Films

Year:

2004

Language:

english

File:

PDF, 329 KB

english, 2004

11

Sub-100 nm MOSFET fabrication with low temperature resist trimming process

Shajan Mathew, Ranganathan Nagarajan, L.K. Bera, Feng Han Hua, Du An Yan, N. Balasubramanian

Journal:

Thin Solid Films

Year:

2004

Language:

english

File:

PDF, 420 KB

english, 2004

12

Effects of preannealing on the diffusion barrier properties for ultrathin W–Si–N thin film

Xin-Ping Qu, Hua Lu, Tao Peng, Guo-Ping Ru, Bing-Zong Li

Journal:

Thin Solid Films

Year:

2004

Language:

english

File:

PDF, 544 KB

english, 2004

13

Electrical evaluation of laser annealed junctions by Hall measurements

Chyiu Hyia Poon, Leng Seow Tan, Byung Jin Cho, Keh Ting Ng, Mousumi Bhat, Lap Chan

Journal:

Thin Solid Films

Year:

2004

Language:

english

File:

PDF, 281 KB

english, 2004

14

Effects of Ti/Co and Co/Ti systems on the germanosilicidation of poly-Si capped poly-Si1−xGex substrate

Y.S. Li, P.S. Lee, K.L. Pey

Journal:

Thin Solid Films

Year:

2004

Language:

english

File:

PDF, 462 KB

english, 2004

15

Determination of band offsets in strained-Si heterolayers

C.K. Maiti, S.K. Samanta, S. Chatterjee, G.K. Dalapati, S. Bhattacharya, B.M. Armstrong, H.S. Gamble, J. McCarthy, T.S. Perova, R.A. Moore

Journal:

Thin Solid Films

Year:

2004

Language:

english

File:

PDF, 201 KB

english, 2004

16

Characterization of tetra methyl cyclo tetra siloxanes-based low-k dielectric film

J. Widodo, W. Lu, S.G. Mhaisalkar, L.C. Hsia, P.Y. Tan, L. Shen, K.Y. Zeng

Journal:

Thin Solid Films

Year:

2004

Language:

english

File:

PDF, 298 KB

english, 2004

17

Investigation of electrical properties of furnace grown gate oxide on strained-Si

L.K. Bera, Shajan Mathew, N. Balasubramanian, C. Leitz, G. Braithwaite, F. Singaporewala, J. Yap, J. Carlin, T. Langdo, T. Lochtefeld, M. Currie, R. Hammond, J. Fiorenza, H. Badawi, M. Bulsara

Journal:

Thin Solid Films

Year:

2004

Language:

english

File:

PDF, 450 KB

english, 2004

18

Sol-gel derived mesoporous silica films used as low dielectric constant materials

Suzhu Yu, Terence K.S. Wong, Xiao Hu, Kantisara Pita

Journal:

Thin Solid Films

Year:

2004

Language:

english

File:

PDF, 631 KB

english, 2004

19

Effect of annealing on the composition and structure of HfO2 and nitrogen-incorporated HfO2

Chia Ching Yeo, Moon Sig Joo, Byung Jin Cho, Sung Jin Whang

Journal:

Thin Solid Films

Year:

2004

Language:

english

File:

PDF, 519 KB

english, 2004

20

Interface and oxide traps in high-κ hafnium oxide films

H. Wong, N. Zhan, K.L. Ng, M.C. Poon, C.W. Kok

Journal:

Thin Solid Films

Year:

2004

Language:

english

File:

PDF, 293 KB

english, 2004

21

The effects of Ca and Pd dopants on gold bonding wire and gold rod

T.S. Saraswati, T. Sritharan, C.I. Pang, Y.H. Chew, C.D. Breach, F. Wulff, S.G. Mhaisalkar, C.C. Wong

Journal:

Thin Solid Films

Year:

2004

Language:

english

File:

PDF, 532 KB

english, 2004

22

The impact of etch-stop layer for borderless contacts on deep submicron CMOS device performance—a comparative study

H. Liao, P.S. Lee, L.N.L. Goh, H. Liu, J.L. Sudijono, Q. Elgin, C. Sanford

Journal:

Thin Solid Films

Year:

2004

Language:

english

File:

PDF, 448 KB

english, 2004

23

Characterization and performance of dielectric diffusion barriers for Cu metallization

Zhe Chen, K. Prasad, C.Y. Li, S.S. Su, D. Gui, P.W. Lu, X. He, S. Balakumar

Journal:

Thin Solid Films

Year:

2004

Language:

english

File:

PDF, 391 KB

english, 2004

24

Low cycle fatigue models for lead-free solders

John H.L. Pang, B.S. Xiong, T.H. Low

Journal:

Thin Solid Films

Year:

2004

Language:

english

File:

PDF, 315 KB

english, 2004

25

The mechanical properties of ultra-low-dielectric-constant films

Y.H. Wang, M.R. Moitreyee, R. Kumar, S.Y. Wu, J.L. Xie, P. Yew, B. Subramanian, L. Shen, K.Y. Zeng

Journal:

Thin Solid Films

Year:

2004

Language:

english

File:

PDF, 475 KB

english, 2004

26

Metal gate technology for nanoscale transistors—material selection and process integration issues

Journal:

Thin Solid Films

Year:

2004

Language:

english

File:

PDF, 705 KB

english, 2004

27

Investigation of copper contamination into interlayer dielectrics by copper process

Ichiro Kobayashi, Tomoe Miyazawa, Masayo Fujimoto, Hiroko Kawaguchi, Tohru Hara

Journal:

Thin Solid Films

Year:

2004

Language:

english

File:

PDF, 158 KB

english, 2004

28

Oxidation of bulk Au–Al intermetallics

C. Xu, C.D. Breach, T. Sritharan, F. Wulff, S.G. Mhaisalkar

Journal:

Thin Solid Films

Year:

2004

Language:

english

File:

PDF, 462 KB

english, 2004

29

Effect of electromigration on interfacial reactions between electroless Ni-P and Sn–3.5% Ag solder

A. Kumar, M. He, Z. Chen, P.S. Teo

Journal:

Thin Solid Films

Year:

2004

Language:

english

File:

PDF, 533 KB

english, 2004

30

Bonding structures of silicon oxynitride prepared by oxidation of Si-rich silicon nitride

M.C. Poon, C.W. Kok, H. Wong, P.J. Chan

Journal:

Thin Solid Films

Year:

2004

Language:

english

File:

PDF, 240 KB

english, 2004

31

Challenges of pattern transfer for ultra-low-k OSG film Aurora™ULK

Vladimir Bliznetsov, May Lee Chua, M.-M. Roy, N. Singh

Journal:

Thin Solid Films

Year:

2004

Language:

english

File:

PDF, 323 KB

english, 2004

32

Effect of post-reflow cooling rate on intermetallic compound formation between Sn–3.5 Ag solder and Ni–P under bump metallization

Min He, Zhong Chen, Guojun Qi, C.C. Wong, S.G. Mhaisalkar

Journal:

Thin Solid Films

Year:

2004

Language:

english

File:

PDF, 1.14 MB

english, 2004

33

Fabrication and characterization of a trilayer germanium nanocrystal memory device with hafnium dioxide as the tunnel dielectric

T.H. Ng, V. Ho, L.W. Teo, M.S. Tay, B.H. Koh, W.K. Chim, W.K. Choi, A.Y. Du, C.H. Tung

Journal:

Thin Solid Films

Year:

2004

Language:

english

File:

PDF, 524 KB

english, 2004

34

The interfacial reaction of Ni with (111)Ge, (100)Si0.75Ge0.25 and (100)Si at 400 °C

L.J. Jin, K.L. Pey, W.K. Choi, E.A. Fitzgerald, D.A. Antoniadis, A.J. Pitera, M.L. Lee, D.Z. Chi, C.H. Tung

Journal:

Thin Solid Films

Year:

2004

Language:

english

File:

PDF, 986 KB

english, 2004

35

Investigation of deposition temperature effect on properties of PECVD SiOCH low-k films

T.K.S. Wong, B. Liu, B. Narayanan, V. Ligatchev, R. Kumar

Journal:

Thin Solid Films

Year:

2004

Language:

english

File:

PDF, 322 KB

english, 2004

36

Static and cyclic relaxation studies in nonconductive adhesives

M. Gunawan, L.T. Davila, E.H. Wong, S.G. Mhaisalkar, T.K. Tsai, S. Osiyemi

Journal:

Thin Solid Films

Year:

2004

Language:

english

File:

PDF, 870 KB

english, 2004

37

Thermal stability of strained Si/Si1−xGex heterostructures for advanced microelectronics devices

L.H. Wong, C.C. Wong, K.K. Ong, J.P. Liu, L. Chan, R. Rao, K.L. Pey, L. Liu, Z.X. Shen

Journal:

Thin Solid Films

Year:

2004

Language:

english

File:

PDF, 335 KB

english, 2004

38

Study of leakage mechanisms of the copper/Black Diamond™ damascene process

K.Y. Yiang, Q. Guo, W.J. Yoo, Ahila Krishnamoorthy

Journal:

Thin Solid Films

Year:

2004

Language:

english

File:

PDF, 236 KB

english, 2004

39

Impact of barrier metal on electrical performance of Cu/low K (Black Diamond™) in 0.13μm dual damascene interconnection

H.Y. Li, C.Y. Li, Y.J. Su, C.F. Tsang

Journal:

Thin Solid Films

Year:

2004

Language:

english

File:

PDF, 568 KB

english, 2004

40

Characterization of low-k dielectric trench surface cleaning after a fluorocarbon etch

Y.S. Tan, Simon Y.M. Chooi, Chian-Yuh Sin, Ping-Yu Ee, M.P. Srinivasan, S.O. Pehkonen

Journal:

Thin Solid Films

Year:

2004

Language:

english

File:

PDF, 500 KB

english, 2004

41

Overcoming intrinsic weakness of ULSI metallization electromigration performances

C.M. Tan, G. Zhang

Journal:

Thin Solid Films

Year:

2004

Language:

english

File:

PDF, 850 KB

english, 2004

42

Comparative studies of physical and chemical properties of plasma-treated CVD low k SiOCH dielectrics

C.F. Tsang, Y.J. Su, V.N. Bliznetsov

Journal:

Thin Solid Films

Year:

2004

Language:

english

File:

PDF, 382 KB

english, 2004

43

Study of interactions between α-Ta films and SiO2 under rapid thermal annealing

Z.L. Yuan, D.H. Zhang, C.Y. Li, K. Prasad, C.M. Tan

Journal:

Thin Solid Films

Year:

2004

Language:

english

File:

PDF, 246 KB

english, 2004

44

Thermal stability of Cu/α-Ta/SiO2/Si structures

Z.L. Yuan, D.H. Zhang, C.Y. Li, K. Prasad, C.M. Tan

Journal:

Thin Solid Films

Year:

2004

Language:

english

File:

PDF, 141 KB

english, 2004

45

Intermetallic compound formation between Sn–3.5Ag solder and Ni-based metallization during liquid state reaction

Min He, Wee Hua Lau, Guojun Qi, Zhong Chen

Journal:

Thin Solid Films

Year:

2004

Language:

english

File:

PDF, 846 KB

english, 2004

46

Enhancing the efficiency of postetch polymer removal using megasonic wet clean for 0.13-μm dual damascene interconnect process

C.K. Chang, T.H. Foo, M. Murkherjee-Roy, Vladimir N. Bliznetov, H.Y. Li

Journal:

Thin Solid Films

Year:

2004

Language:

english

File:

PDF, 325 KB

english, 2004

47

Finite element analysis for microwave cure of underfill in flip chip packaging

Lie Liu, Sung Yi, Lin Seng Ong, Kerm Sin Chian

Journal:

Thin Solid Films

Year:

2004

Language:

english

File:

PDF, 443 KB

english, 2004

48

Alpha radiation sources in low alpha materials and implications for low alpha materials refinement

Brett M. Clark, Martin W. Weiser, Ignatius J. Rasiah

Journal:

Thin Solid Films

Year:

2004

Language:

english

File:

PDF, 206 KB

english, 2004

49

Interfacial reaction between Sn-rich solders and Ni-based metallization

M. He, A. Kumar, P.T. Yeo, G.J. Qi, Z. Chen

Journal:

Thin Solid Films

Year:

2004

Language:

english

File:

PDF, 1.13 MB

english, 2004

50

Influence of Sb on IMC growth in Sn–Ag–Cu–Sb Pb-free solder joints in reflow process

B.L. Chen, G.Y. Li

Journal:

Thin Solid Films

Year:

2004

Language:

english

File:

PDF, 837 KB

english, 2004

51

Aging treatment characteristics of solder bump joint for high reliability optical module

Kyung-Seob Kim, Chung-Hee Yu, Jun-Mo Yang

Journal:

Thin Solid Films

Year:

2004

Language:

english

File:

PDF, 494 KB

english, 2004

52

Effect of process parameters on sidewall roughness in polymeric optical waveguides

S.K. Pani, C.C. Wong, K. Sudharsanam, S.G. Mhaisalkar, V. Lim, S. Mohanraj, P.V. Ramana

Journal:

Thin Solid Films

Year:

2004

Language:

english

File:

PDF, 531 KB

english, 2004

53

Thermal, electrical, and mechanical properties of layered substrates for microelectronic applications

J. Ma, Zeming He

Journal:

Thin Solid Films

Year:

2004

Language:

english

File:

PDF, 235 KB

english, 2004

54

Glass-to-glass anodic bonding process and electrostatic force

J. Wei, S.M.L. Nai, C.K. Wong, L.C. Lee

Journal:

Thin Solid Films

Year:

2004

Language:

english

File:

PDF, 269 KB

english, 2004

55

Microstructural characterization of low dielectric silica xerogel film

Z.W. He, C.M. Zhen, X.Q. Liu, W. Lan, D.Y. Xu, Y.Y. Wang

Journal:

Thin Solid Films

Year:

2004

Language:

english

File:

PDF, 381 KB

english, 2004

56

Comparative study of argon and hydrogen/helium plasma treatments on the properties of Cu/SiLK damascene structures for interconnect technology

C.Y. Li, D.H. Zhang, S.S. Su, P.W. Lu, X. He, G.J. Jia, Zhe Chen, S.Y. Wu, Rakesh Kumar

Journal:

Thin Solid Films

Year:

2004

Language:

english

File:

PDF, 300 KB

english, 2004

57

Comparative study of Ta, TaN and Ta/TaN bi-layer barriers for Cu-ultra low-k porous polymer integration

L.Y. Yang, D.H. Zhang, C.Y. Li, P.D. Foo

Journal:

Thin Solid Films

Year:

2004

Language:

english

File:

PDF, 418 KB

english, 2004

58

Characterization of Cu/Ta/ultra low-k porous polymer structures for multilevel interconnects

L.Y. Yang, D.H. Zhang, C.Y. Li, R. Liu, A.T.S. Wee, P.D. Foo

Journal:

Thin Solid Films

Year:

2004

Language:

english

File:

PDF, 274 KB

english, 2004

59

Effects of Cu diffusion behaviors on electronic property of Cu/Ta/SiO2/Si structure

S. Li, H.S. Park, M.H. Liang, T.H. Yip, O. Prabhakar

Journal:

Thin Solid Films

Year:

2004

Language:

english

File:

PDF, 508 KB

english, 2004

60

Development and reliability of non-conductive adhesive flip-chip packages

L.K. Teh, E. Anto, C.C. Wong, S.G. Mhaisalkar, E.H. Wong, P.S. Teo, Z. Chen

Journal:

Thin Solid Films

Year:

2004

Language:

english

File:

PDF, 1.66 MB

english, 2004

61

Preparation of LaNiO3 thin films by mist plasma evaporation

Hui Huang, Xi Yao

Journal:

Thin Solid Films

Year:

2004

Language:

english

File:

PDF, 297 KB

english, 2004

62

Effects of calcium and palladium on mechanical properties and stored energy of hard-drawn gold bonding wire

Y.H. Chew, C.C. Wong, C.D. Breach, F. Wulff, S.G. Mhaisalkar, C.I. Pang, Saraswati

Journal:

Thin Solid Films

Year:

2004

Language:

english

File:

PDF, 413 KB

english, 2004

63

EMC characterization and process study for electronics packaging

S.L. Liu, G. Chen, M.S. Yong

Journal:

Thin Solid Films

Year:

2004

Language:

english

File:

PDF, 431 KB

english, 2004

64

Low dielectric constant films prepared by plasma-enhanced chemical vapor deposition from trimethylsilane

M.R. Wang, Rusli, M.B. Yu, N. Babu, C.Y. Li, K. Rakesh

Journal:

Thin Solid Films

Year:

2004

Language:

english

File:

PDF, 390 KB

english, 2004

65

Effect of surface treatment on electromigration in sub-micron Cu damascene interconnects

A.V. Vairagar, S.G. Mhaisalkar, Ahila Krishnamoorthy

Journal:

Thin Solid Films

Year:

2004

Language:

english

File:

PDF, 544 KB

english, 2004

66

Feasibility study of using thin aluminum nitride film as a buffer layer for dual metal gate process

Chang Seo Park, Byung Jin Cho, N. Balasubramanian, Dim-Lee Kwong

Journal:

Thin Solid Films

Year:

2004

Language:

english

File:

PDF, 459 KB

english, 2004

67

Influence of bonding parameters on electrostatic force in anodic wafer bonding

G.Y. Li, L. Wang

Journal:

Thin Solid Films

Year:

2004

Language:

english

File:

PDF, 1.75 MB

english, 2004

68

Adhesion studies of low-k silsesquioxane

Yao-Yi Cheng, Jiuq Yi Kan, I-Shun Lin

Journal:

Thin Solid Films

Year:

2004

Language:

english

File:

PDF, 476 KB

english, 2004

69

Selective growth of carbon nanotubes and their application to triode-type field emitter arrays

Hyung Soo Uh, Soo Myun Lee, Pil Goo Jeon, Byung Hwak Kwak, Sang Sik Park, Sang Jik Kwon, Euo Sik Cho, Sung Woo Ko, Jong Duk Lee, Chun Gyoo Lee

Journal:

Thin Solid Films

Year:

2004

Language:

english

File:

PDF, 559 KB

english, 2004

70

Advances in heteroepitaxy of oxides on silicon

Z. Yu, Y. Liang, C. Overgaard, X. Hu, J. Curless, H. Li, Y. Wei, B. Craigo, D. Jordan, R. Droopad, J. Finder, K. Eisenbeiser, D. Marshall, K. Moore, J. Kulik, P. Fejes

Journal:

Thin Solid Films

Year:

2004

Language:

english

File:

PDF, 1.27 MB

english, 2004

71

Peeling and delamination in Cu/SiLK™ process during Cu-CMP

S. Balakumar, X.T. Chen, Y.W. Chen, T. Selvaraj, B.F. Lin, R. Kumar, T. Hara, M. Fujimoto, Y. Shimura

Journal:

Thin Solid Films

Year:

2004

Language:

english

File:

PDF, 623 KB

english, 2004

72

Thermal stability, phase and interface uniformity of Ni-silicide formed by Ni–Si solid-state reaction

Xin-Ping Qu, Yu-Long Jiang, Guo-Ping Ru, Fang Lu, Bing-Zong Li, C. Detavernier, R.L. Van Meirhaeghe

Journal:

Thin Solid Films

Year:

2004

Language:

english

File:

PDF, 347 KB

english, 2004

73

Thermal cycling aging effects on Sn–Ag–Cu solder joint microstructure, IMC and strength

John H.L. Pang, T.H. Low, B.S. Xiong, Xu Luhua, C.C. Neo

Journal:

Thin Solid Films

Year:

2004

Language:

english

File:

PDF, 882 KB

english, 2004

74

Effect of surface treatment on dielectric leakage and breakdown of copper damascene interconnects

V.C. Ngwan, Chunxiang Zhu, Ahila Krishnamoorthy

Journal:

Thin Solid Films

Year:

2004

Language:

english

File:

PDF, 340 KB

english, 2004

75

Effect of ramp rate on dielectric breakdown in CU–SiOC interconnects

K.H. Cheng, Ahila Krishnamoorthy

Journal:

Thin Solid Films

Year:

2004

Language:

english

File:

PDF, 407 KB

english, 2004

76

Ni(Pt) alloy silicidation on (100) Si and poly-silicon lines

K.L. Pey, P.S. Lee, D. Mangelinck

Journal:

Thin Solid Films

Year:

2004

Language:

english

File:

PDF, 1.26 MB

english, 2004

77

Characterization of the junction leakage of Ti-capped Ni-silicided junctions

N.G. Toledo, P.S. Lee, K.L. Pey

Journal:

Thin Solid Films

Year:

2004

Language:

english

File:

PDF, 925 KB

english, 2004

78

The use of electroless copper seed in electrochemical deposited copper interconnect

Wang Ling Goh, Kee Tchuan Tan

Journal:

Thin Solid Films

Year:

2004

Language:

english

File:

PDF, 202 KB

english, 2004

79

Barrier layer effects on reliabilities of copper metallization

Z.W. Yang, D.H. Zhang, C.Y. Li, C.M. Tan, K. Prasad

Journal:

Thin Solid Films

Year:

2004

Language:

english

File:

PDF, 319 KB

english, 2004

80

Study of copper diffusion into Ta and TaN barrier materials for MOS devices

S.W. Loh, D.H. Zhang, C.Y. Li, R. Liu, A.T.S. Wee

Journal:

Thin Solid Films

Year:

2004

Language:

english

File:

PDF, 342 KB

english, 2004

81

Effects of phosphorus implantation and subsequent growth on diamond

Euo Sik Cho, Cheon An Lee, Gwanghyeon Baek, Hyung Soo Uh, Sang Jik Kwon, Hyungcheol Shin, Byung-Gook Park, Jong Duk Lee

Journal:

Thin Solid Films

Year:

2004

Language:

english

File:

PDF, 448 KB

english, 2004

82

Thermal performance of a phase change material on a nickel-plated surface

M.H. Nurmawati, K.S. Siow, I.J. Rasiah

Journal:

Thin Solid Films

Year:

2004

Language:

english

File:

PDF, 536 KB

english, 2004

83

Development of compliant coating system for transfer molding of sensitive silicon dice

N. Srikanth, T.H. Kuah, S.C. Ho, Charles J. Vath III

Journal:

Thin Solid Films

Year:

2004

Language:

english

File:

PDF, 418 KB

english, 2004

84

Critical study of thermosonic copper ball bonding

N. Srikanth, S. Murali, Y.M. Wong, Charles J. Vath III

Journal:

Thin Solid Films

Year:

2004

Language:

english

File:

PDF, 614 KB

english, 2004

85

A FinFET and Tri-gate MOSFET's channel structure patterning and its influence on the device performance

S. Jagar, Navab Singh, Sohan S. Mehta, Naveen Agrawal, G. Samudra, N. Balasubramanian

Journal:

Thin Solid Films

Year:

2004

Language:

english

File:

PDF, 966 KB

english, 2004

86

Wet etching characteristics and surface morphology evaluation of MOCVD grown HfO2 film

M. Balasubramanian, L.K. Bera, Shajan Mathew, N. Balasubramanian, Vanissa Lim, M.S. Joo, B.J. Cho

Journal:

Thin Solid Films

Year:

2004

Language:

english

File:

PDF, 378 KB

english, 2004

87

Material and design considerations of FBGA reliability performance

Teck Kheng Lee, Teng Chye Ng, Yih Ming Chai

Journal:

Thin Solid Films

Year:

2004

Language:

english

File:

PDF, 1.27 MB

english, 2004

88

Chemical mechanical polishing of copper layer employing MnO2 slurry

Tohru Hara, S. Balakumar

Journal:

Thin Solid Films

Year:

2004

Language:

english

File:

PDF, 319 KB

english, 2004

89

C–DIC: a new microscopy method for rational study of phase structures in incident light arrangement

Rainer Danz, Peter Gretscher

Journal:

Thin Solid Films

Year:

2004

Language:

english

File:

PDF, 462 KB

english, 2004

90

STEM study of interfacial reaction at HfxAl1−xOy/Si interfaces

J.Y. Dai, K. Li, P.F. Lee, X. Zhao, S. Redkar

Journal:

Thin Solid Films

Year:

2004

Language:

english

File:

PDF, 316 KB

english, 2004

91

Empirical equations for moisture absorption of a rigid substrate

Teck Kheng Lee, Kian Chai Lee, Sian Yong Khoo

Journal:

Thin Solid Films

Year:

2004

Language:

english

File:

PDF, 632 KB

english, 2004

92

Author Index of Volumes 462–463

Journal:

Thin Solid Films

Year:

2004

File:

PDF, 42 KB

2004

93

Editorial Board

Journal:

Thin Solid Films

Year:

2004

Language:

english

File:

PDF, 22 KB

english, 2004

94

Subject Index of Volumes 462–463

Journal:

Thin Solid Films

Year:

2004

Language:

english

File:

PDF, 91 KB

english, 2004

95

Effect of processing temperature on the properties of sol–gel-derived mesoporous silica films

Suzhu Yu, Terence K.S. Wong, Xiao Hu, Tat Kean Goh

Journal:

Thin Solid Films

Year:

2004

Language:

english

File:

PDF, 341 KB

english, 2004

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