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Thermal stability of strained Si/Si1−xGex heterostructures for advanced microelectronics devices
L.H. Wong, C.C. Wong, K.K. Ong, J.P. Liu, L. Chan, R. Rao, K.L. Pey, L. Liu, Z.X. ShenVolume:
462-463
Year:
2004
Language:
english
Pages:
4
DOI:
10.1016/j.tsf.2004.05.050
File:
PDF, 335 KB
english, 2004