Intermetallic compound formation between Sn–3.5Ag solder and Ni-based metallization during liquid state reaction
Min He, Wee Hua Lau, Guojun Qi, Zhong ChenVolume:
462-463
Year:
2004
Language:
english
Pages:
8
DOI:
10.1016/j.tsf.2004.05.058
File:
PDF, 846 KB
english, 2004