Enhancing the efficiency of postetch polymer removal using...

Thin Solid Films 2004 Vol. 462-463; Iss. none

Enhancing the efficiency of postetch polymer removal using megasonic wet clean for 0.13-μm dual damascene interconnect process

C.K. Chang, T.H. Foo, M. Murkherjee-Roy, Vladimir N. Bliznetov, H.Y. Li
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Volume:
462-463
Year:
2004
Language:
english
Pages:
5
DOI:
10.1016/j.tsf.2004.05.059
File:
PDF, 325 KB
english, 2004
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