Aging treatment characteristics of solder bump joint for...

Aging treatment characteristics of solder bump joint for high reliability optical module

Kyung-Seob Kim, Chung-Hee Yu, Jun-Mo Yang
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
462-463
Year:
2004
Language:
english
Pages:
6
DOI:
10.1016/j.tsf.2004.05.064
File:
PDF, 494 KB
english, 2004
Conversion to is in progress
Conversion to is failed