Comparative study of argon and hydrogen/helium plasma...

Thin Solid Films 2004 Vol. 462-463; Iss. none

Comparative study of argon and hydrogen/helium plasma treatments on the properties of Cu/SiLK damascene structures for interconnect technology

C.Y. Li, D.H. Zhang, S.S. Su, P.W. Lu, X. He, G.J. Jia, Zhe Chen, S.Y. Wu, Rakesh Kumar
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Volume:
462-463
Year:
2004
Language:
english
Pages:
4
DOI:
10.1016/j.tsf.2004.05.069
File:
PDF, 300 KB
english, 2004
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