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Characterization of Cu/Ta/ultra low-k porous polymer structures for multilevel interconnects
L.Y. Yang, D.H. Zhang, C.Y. Li, R. Liu, A.T.S. Wee, P.D. FooVolume:
462-463
Year:
2004
Language:
english
Pages:
4
DOI:
10.1016/j.tsf.2004.05.071
File:
PDF, 274 KB
english, 2004