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Effect of surface treatment on electromigration in sub-micron Cu damascene interconnects
A.V. Vairagar, S.G. Mhaisalkar, Ahila KrishnamoorthyVolume:
462-463
Year:
2004
Language:
english
Pages:
5
DOI:
10.1016/j.tsf.2004.05.082
File:
PDF, 544 KB
english, 2004