Influence of bonding parameters on electrostatic force in...

Influence of bonding parameters on electrostatic force in anodic wafer bonding

G.Y. Li, L. Wang
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Volume:
462-463
Year:
2004
Language:
english
Pages:
5
DOI:
10.1016/j.tsf.2004.05.084
File:
PDF, 1.75 MB
english, 2004
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