Peeling and delamination in Cu/SiLK™ process during Cu-CMP

S. Balakumar, X.T. Chen, Y.W. Chen, T. Selvaraj, B.F. Lin, R. Kumar, T. Hara, M. Fujimoto, Y. Shimura

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Volume:

462-463

Year:

2004

Language:

english

Pages:

DOI:

10.1016/j.tsf.2004.05.090

File:

PDF, 623 KB

english, 2004

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