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Peeling and delamination in Cu/SiLK™ process during Cu-CMP
S. Balakumar, X.T. Chen, Y.W. Chen, T. Selvaraj, B.F. Lin, R. Kumar, T. Hara, M. Fujimoto, Y. ShimuraVolume:
462-463
Year:
2004
Language:
english
Pages:
7
DOI:
10.1016/j.tsf.2004.05.090
File:
PDF, 623 KB
english, 2004