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Thermal cycling aging effects on Sn–Ag–Cu solder joint microstructure, IMC and strength
John H.L. Pang, T.H. Low, B.S. Xiong, Xu Luhua, C.C. NeoVolume:
462-463
Year:
2004
Language:
english
Pages:
6
DOI:
10.1016/j.tsf.2004.05.092
File:
PDF, 882 KB
english, 2004