![](/img/cover-not-exists.png)
Effect of surface treatment on dielectric leakage and breakdown of copper damascene interconnects
V.C. Ngwan, Chunxiang Zhu, Ahila KrishnamoorthyVolume:
462-463
Year:
2004
Language:
english
Pages:
4
DOI:
10.1016/j.tsf.2004.05.093
File:
PDF, 340 KB
english, 2004