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Barrier layer effects on reliabilities of copper metallization
Z.W. Yang, D.H. Zhang, C.Y. Li, C.M. Tan, K. PrasadVolume:
462-463
Year:
2004
Language:
english
Pages:
4
DOI:
10.1016/j.tsf.2004.05.101
File:
PDF, 319 KB
english, 2004