Chemical mechanical polishing of copper layer employing...

Chemical mechanical polishing of copper layer employing MnO2 slurry

Tohru Hara, S. Balakumar
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Volume:
462-463
Year:
2004
Language:
english
Pages:
6
DOI:
10.1016/j.tsf.2004.05.123
File:
PDF, 319 KB
english, 2004
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