Cu films deposition by dielectric barrier discharge in...

Cu films deposition by dielectric barrier discharge in supercritical CO2, Ar and Xe environments

Hirokazu Kikuchi, Hirotake Kubo, Takaaki Tomai, Kazuo Terashima
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Volume:
516
Year:
2008
Language:
english
Pages:
6
DOI:
10.1016/j.tsf.2007.11.042
File:
PDF, 2.02 MB
english, 2008
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