![](/img/cover-not-exists.png)
Adhesion and Removal of Alumina Slurry Particles on Wafer Surfaces in Cu CMP
Hong, Yi Koan, Han, Ja Hyung, Lee, Jin Hyung, Park, Jin Goo, Busnaina, Ahmed A.Volume:
103-104
Year:
2005
Language:
english
Journal:
Solid State Phenomena
DOI:
10.4028/www.scientific.net/SSP.103-104.275
File:
PDF, 518 KB
english, 2005