New Post Etch Polymer Removal Process for Al-Interconnects...

Solid State Phenomena 2005 Vol. 103-104

New Post Etch Polymer Removal Process for Al-Interconnects and Vias in Tank and Spray Tools Using a New Inorganic Chemistry

Mellies, Raimund, Kunz, Stefan, Nilius, Franz, Mayer, Dieter, Kühner, Andreas
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Volume:
103-104
Year:
2005
Language:
english
Journal:
Solid State Phenomena
DOI:
10.4028/www.scientific.net/SSP.103-104.381
File:
PDF, 1.43 MB
english, 2005
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