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Coupling between microstrip lines with finite width ground plane embedded in thin-film circuits
Ponchak, G.E., Dalton, E., Tentzeris, M.M., Papapolymerou, J.Volume:
28
Language:
english
Journal:
IEEE Transactions on Advanced Packaging
DOI:
10.1109/TADVP.2005.846933
Date:
May, 2005
File:
PDF, 460 KB
english, 2005