Methodology for predicting solder joint reliability in...

Methodology for predicting solder joint reliability in semiconductor packages

Rajendra D Pendse, Peng Zhou
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Volume:
42
Year:
2002
Language:
english
Pages:
5
DOI:
10.1016/s0026-2714(01)00130-5
File:
PDF, 175 KB
english, 2002
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