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Volume 42; Issue 2
Main
Microelectronics Reliability
Volume 42; Issue 2
Microelectronics Reliability
Volume 42; Issue 2
1
Methodology for predicting solder joint reliability in semiconductor packages
Rajendra D Pendse
,
Peng Zhou
Journal:
Microelectronics Reliability
Year:
2002
Language:
english
File:
PDF, 175 KB
Your tags:
english, 2002
2
Changes in the characteristics of CuInGaSe2 solar cells under light irradiation and during recovery: degradation analysis by the feeble light measuring method
Takeshi Yanagisawa
,
Takeshi Kojima
,
Tadamasa Koyanagi
,
Kiyoshi Takahisa
,
Kuniomi Nakamura
Journal:
Microelectronics Reliability
Year:
2002
Language:
english
File:
PDF, 198 KB
Your tags:
english, 2002
3
Reliability of via-in-pad structures in mechanical cycling fatigue
K Jonnalagadda
Journal:
Microelectronics Reliability
Year:
2002
Language:
english
File:
PDF, 289 KB
Your tags:
english, 2002
4
On discrete random dopant modeling in drift-diffusion simulations: physical meaning of `atomistic' dopants
Nobuyuki Sano
,
Kazuya Matsuzawa
,
Mikio Mukai
,
Noriaki Nakayama
Journal:
Microelectronics Reliability
Year:
2002
Language:
english
File:
PDF, 1.08 MB
Your tags:
english, 2002
5
Underfill of flip chip on organic substrate: viscosity, surface tension, and contact angle
Jinlin Wang
Journal:
Microelectronics Reliability
Year:
2002
Language:
english
File:
PDF, 295 KB
Your tags:
english, 2002
6
Use of scanning capacitance microscopy for controlling wafer processing
O Jeandupeux
,
V Marsico
,
A Acovic
,
P Fazan
,
H Brune
,
K Kern
Journal:
Microelectronics Reliability
Year:
2002
Language:
english
File:
PDF, 276 KB
Your tags:
english, 2002
7
Interconnecting to aluminum- and copper-based semiconductors (electroless-nickel/gold for solder bumping and wire bonding)
Andrew J.G Strandjord
,
Scott Popelar
,
Christine Jauernig
Journal:
Microelectronics Reliability
Year:
2002
Language:
english
File:
PDF, 1.53 MB
Your tags:
english, 2002
8
Effect of mechanical stress induced by etch-stop nitride: impact on deep-submicron transistor performance
Shinya Ito
,
Hiroaki Namba
,
Tsuyoshi Hirata
,
Koichi Ando
,
Shin Koyama
,
Nobuyuki Ikezawa
,
Tatsuya Suzuki
,
Takehiro Saitoh
,
Tadahiko Horiuchi
Journal:
Microelectronics Reliability
Year:
2002
Language:
english
File:
PDF, 668 KB
Your tags:
english, 2002
9
Analysis of thermal stresses in metal interconnects with multilevel structures
M.S. Kilijanski
,
Y.-L. Shen
Journal:
Microelectronics Reliability
Year:
2002
Language:
english
File:
PDF, 178 KB
Your tags:
english, 2002
10
Wirebond profiles characterized by a modified linkage-spring model which includes a looping speed factor
Yu-Lung Lo
,
Chih-Chiang Tsao
Journal:
Microelectronics Reliability
Year:
2002
Language:
english
File:
PDF, 476 KB
Your tags:
english, 2002
11
Breakdown fields and conduction mechanisms in thin Ta2O5 layers on Si for high density DRAMs
E. Atanassova
,
A. Paskaleva
Journal:
Microelectronics Reliability
Year:
2002
Language:
english
File:
PDF, 561 KB
Your tags:
english, 2002
12
1/fγ Noise separated from white noise with wavelet denoising
Lei Du
,
Yiqi Zhuang
,
Yong Wu
Journal:
Microelectronics Reliability
Year:
2002
Language:
english
File:
PDF, 151 KB
Your tags:
english, 2002
13
Power capability limits of power MOSFET devices
Young S Chung
,
Bob Baird
Journal:
Microelectronics Reliability
Year:
2002
Language:
english
File:
PDF, 352 KB
Your tags:
english, 2002
14
The processing technology and electronic packaging of CVD diamond: a case study for GaAs/CVD diamond plastic packages
Philip M Fabis
Journal:
Microelectronics Reliability
Year:
2002
Language:
english
File:
PDF, 1.81 MB
Your tags:
english, 2002
15
The effect of transition region on the direct tunneling current and Fowler–Nordheim tunneling current oscillations in ultrathin MOS structures
Lingfeng Mao
,
Heqiu Zhang
,
Changhua Tan
,
Mingzhen Xu
Journal:
Microelectronics Reliability
Year:
2002
Language:
english
File:
PDF, 272 KB
Your tags:
english, 2002
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