Reliability evaluation of ultra-thin CSP using new...

Reliability evaluation of ultra-thin CSP using new flip-chip bonding technology––double-sided CSP and single-sided CSP

Kazuto Nishida, Kazumichi Shimizu, Michiro Yoshino, Hideo Koguchi, Nipon Taweejun
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Volume:
43
Year:
2003
Language:
english
Pages:
11
DOI:
10.1016/s0026-2714(03)00166-5
File:
PDF, 739 KB
english, 2003
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