Volume 43; Issue 12

Microelectronics Reliability

Volume 43; Issue 12

1

Defect generation in InGaN/GaN light-emitting diodes under forward and reverse electrical stresses

X.A. Cao, P.M. Sandvik, S.F. LeBoeuf, S.D. Arthur

Journal:

Microelectronics Reliability

Year:

2003

Language:

english

File:

PDF, 334 KB

english, 2003

2

Experimental study and theoretical prediction of aging induced frequency shift of crystal resonators and oscillators

Y.S. Roh, A. Asiz, W.P. Zhang, Y. Xi

Journal:

Microelectronics Reliability

Year:

2003

Language:

english

File:

PDF, 325 KB

english, 2003

3

Reliable study of digital IC circuits with margin voltage among variable DC power supply, electromagnetic interference and conducting wire antenna

Journal:

Microelectronics Reliability

Year:

2003

Language:

english

File:

PDF, 366 KB

english, 2003

4

Issues in accelerated electromigration of solder bumps

Journal:

Microelectronics Reliability

Year:

2003

Language:

english

File:

PDF, 386 KB

english, 2003

5

Measurement of high electrical current density effects in solder joints

Hua Ye, Douglas C. Hopkins, Cemal Basaran

Journal:

Microelectronics Reliability

Year:

2003

Language:

english

File:

PDF, 696 KB

english, 2003

6

Reliability evaluation of ultra-thin CSP using new flip-chip bonding technology––double-sided CSP and single-sided CSP

Kazuto Nishida, Kazumichi Shimizu, Michiro Yoshino, Hideo Koguchi, Nipon Taweejun

Journal:

Microelectronics Reliability

Year:

2003

Language:

english

File:

PDF, 739 KB

english, 2003

7

Thermally driven reliability issues in microelectronic systems: status-quo and challenges

Clemens J.M. Lasance

Journal:

Microelectronics Reliability

Year:

2003

Language:

english

File:

PDF, 236 KB

english, 2003

8

The study on failure mechanisms of bond pad metal peeling: Part A––Experimental investigation

Insu Jeon, Qwanho Chung

Journal:

Microelectronics Reliability

Year:

2003

Language:

english

File:

PDF, 893 KB

english, 2003

9

An examination of the applicability of the DNP metric on first level reliability assessments in underfilled electronic packages

W. Dauksher, W.S. Burton

Journal:

Microelectronics Reliability

Year:

2003

Language:

english

File:

PDF, 399 KB

english, 2003

10

Effect of voids on the reliability of BGA/CSP solder joints

Mohammad Yunus, K. Srihari, J.M. Pitarresi, Anthony Primavera

Journal:

Microelectronics Reliability

Year:

2003

Language:

english

File:

PDF, 752 KB

english, 2003

11

Comparative study of the dissolution kinetics of electrolytic Ni and electroless Ni–P by the molten Sn3.5Ag0.5Cu solder alloy

M.N Islam, Y.C Chan, A Sharif, M.O Alam

Journal:

Microelectronics Reliability

Year:

2003

Language:

english

File:

PDF, 505 KB

english, 2003

12

Improving the deflection of wire bonds in stacked chip scale package (CSP)

Y.F. Yao, T.Y. Lin, K.H. Chua

Journal:

Microelectronics Reliability

Year:

2003

Language:

english

File:

PDF, 544 KB

english, 2003

13

The study on failure mechanisms of bond pad metal peeling: Part B––Numerical analysis

Journal:

Microelectronics Reliability

Year:

2003

Language:

english

File:

PDF, 694 KB

english, 2003

14

The effect of small-signal AC voltages on C–V characterization and parameter extraction of SiO2 thin films

Hongguo Zhang, Pant Gurang, Nihdi Sigh, Quvdo Manuel, Robert Wallace, Bruce Gnade, Kevin Stokes

Journal:

Microelectronics Reliability

Year:

2003

Language:

english

File:

PDF, 422 KB

english, 2003

15

Moisture absorption and diffusion characterisation of packaging materials––advanced treatment

E.H. Wong, R. Rajoo

Journal:

Microelectronics Reliability

Year:

2003

Language:

english

File:

PDF, 395 KB

english, 2003

16

Author Index to Volume 42

Journal:

Microelectronics Reliability

Year:

2003

File:

PDF, 209 KB

2003

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