Thermally driven reliability issues in microelectronic...

Thermally driven reliability issues in microelectronic systems: status-quo and challenges

Clemens J.M. Lasance
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Volume:
43
Year:
2003
Language:
english
Pages:
6
DOI:
10.1016/s0026-2714(03)00183-5
File:
PDF, 236 KB
english, 2003
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