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Reliability and Au-concentration in OLB solder fillets of TAB-devices having a 75 μm pitch : Elke Zakel, Jurgen Villain and Herbert Reichl. IEEE Transactions on Components, Packaging and Manufacturing Technology—Part B, 19 (1), 138 (1996)
Volume:
37
Year:
1997
Language:
english
DOI:
10.1016/s0026-2714(97)87661-5
File:
PDF, 140 KB
english, 1997