Volume 37; Issue 4

Microelectronics Reliability

Volume 37; Issue 4

1

Survival function of a component under random strength attenuation

A. Rekha, T. Shyam Sunder

Journal:

Microelectronics Reliability

Year:

1997

Language:

english

File:

PDF, 356 KB

english, 1997

2

Comparative redundancy, an alternative to triple modular redundant system design

Kenneth W. Philp, Norman D. Deans

Journal:

Microelectronics Reliability

Year:

1997

Language:

english

File:

PDF, 349 KB

english, 1997

3

Modelling of gate-induced drain leakage in relation to technological parameters and temperature

A. Bouhdada, S. Bakkali, A. Touhami

Journal:

Microelectronics Reliability

Year:

1997

Language:

english

File:

PDF, 339 KB

english, 1997

4

Poisson mixture yield models for integrated circuits: A critical review

M. Raghavachari, Aparna Srinivasan, Pasquale Sullo

Journal:

Microelectronics Reliability

Year:

1997

Language:

english

File:

PDF, 1.38 MB

english, 1997

5

Consecutive-k, r-out-of-n:DFM systems

Journal:

Microelectronics Reliability

Year:

1997

Language:

english

File:

PDF, 695 KB

english, 1997

6

Optimal assignment of priorities for the machine interference problems

Journal:

Microelectronics Reliability

Year:

1997

Language:

english

File:

PDF, 515 KB

english, 1997

7

Optimization of connecting two communication networks subject to a reliability constraint

Lian-Chang Zhao, Fang-Ming Shao

Journal:

Microelectronics Reliability

Year:

1997

Language:

english

File:

PDF, 462 KB

english, 1997

8

SPICE application in the study of the behaviour of multi-state systems described by Markov models

Muhammad Taher Abuelma'atti, Isa Salman Qambar

Journal:

Microelectronics Reliability

Year:

1997

Language:

english

File:

PDF, 329 KB

english, 1997

9

Probabilistic analysis of a two-unit cold standby redundant system subject to failure of controlled weather device

M.A.W. Mahmoud, M.E. Moshref

Journal:

Microelectronics Reliability

Year:

1997

Language:

english

File:

PDF, 458 KB

english, 1997

10

Formulas for analyzing a redundant robot configuration with a built-in safety system

B.S. Dhillon, N. Yang

Journal:

Microelectronics Reliability

Year:

1997

Language:

english

File:

PDF, 472 KB

english, 1997

11

A reliability study of a small vehicle

Journal:

Microelectronics Reliability

Year:

1997

Language:

english

File:

PDF, 131 KB

english, 1997

12

Estimation of the degradation of amorphous silicon solar cells

Takeshi Yanagisawa

Journal:

Microelectronics Reliability

Year:

1997

Language:

english

File:

PDF, 555 KB

english, 1997

13

Optimal design improving a communication network reliability

Fang-Ming Shao, Lian-Chang Zhao

Journal:

Microelectronics Reliability

Year:

1997

Language:

english

File:

PDF, 484 KB

english, 1997

14

Analysis of consecutive k-out-of-n: F systems with single repair facility

U. Dinesh Kumar, M.N. Gopalan

Journal:

Microelectronics Reliability

Year:

1997

Language:

english

File:

PDF, 352 KB

english, 1997

15

Estimation of parameters of a model of a complex repairable system

Sanku Dey, Pranita Sarmah

Journal:

Microelectronics Reliability

Year:

1997

Language:

english

File:

PDF, 293 KB

english, 1997

16

Optimum interchangement time for a two-dissimilar-unit with two types of repairman

V. Sridharan, P. Mohanavadivu

Journal:

Microelectronics Reliability

Year:

1997

Language:

english

File:

PDF, 254 KB

english, 1997

17

Reliability of a cascade system with exponential strength and gamma stress

A. Rekha, T. Shyam Sunder

Journal:

Microelectronics Reliability

Year:

1997

Language:

english

File:

PDF, 216 KB

english, 1997

18

Quality enhances reliability. A utility's big customer will willingly sign up for power that flows smoothly enough not to trip up electronic equipment : D. Daniel Sabin and Ashok Sundaram. IEEE Spectrum, 34 (February 1996)

Journal:

Microelectronics Reliability

Year:

1997

Language:

english

File:

PDF, 122 KB

english, 1997

19

Proposed new DoD standard for product acceptance : Donald S. Ermer and Daniel P. Kedzie, II. 1996 Proceedings of the Annual Reliability and Maintainability Symposium, 24 (1996)

Journal:

Microelectronics Reliability

Year:

1997

Language:

english

File:

PDF, 257 KB

english, 1997

20

An overview of environmental reliability testing : Hank Caruso. 1996 Proceedings of the Annual Reliability and Maintainability Symposium, 102 (1996)

Journal:

Microelectronics Reliability

Year:

1997

Language:

english

File:

PDF, 142 KB

english, 1997

21

Development of ultra-compact plastic-packaged high-isolation GaAs SPDT switch : Hisanori Uda et al. IEEE Transactions on Components, Packaging and Manufacturing Technology—Part B, 19 (1), 182 (1996)

Journal:

Microelectronics Reliability

Year:

1997

Language:

english

File:

PDF, 142 KB

english, 1997

22

Higher-integrated spread-type stacked capacitor and its suitable arsenic solid-diffusion method : N. Matsuo, T. Miyoshi and K. Matsubara. Microelectronics Journal, 27, 73 (1996)

Journal:

Microelectronics Reliability

Year:

1997

Language:

english

File:

PDF, 142 KB

english, 1997

23

International standards: their role in a global economy : Daniel J. O'Leary. 1996 Proceedings of the Annual Reliability and Maintainability Symoposium, 17 (1996)

Journal:

Microelectronics Reliability

Year:

1997

Language:

english

File:

PDF, 142 KB

english, 1997

24

Reliability and Au-concentration in OLB solder fillets of TAB-devices having a 75 μm pitch : Elke Zakel, Jurgen Villain and Herbert Reichl. IEEE Transactions on Components, Packaging and Manufacturing Technology—Part B, 19 (1), 138 (1996)

Journal:

Microelectronics Reliability

Year:

1997

Language:

english

File:

PDF, 140 KB

english, 1997

25

High-frequency measurement of multilayer ceramic capacitors : Yukio Sakabe et al. IEEE Transactions on Components, Packaging and Manufacturing Technology—Part B, 19 (1), 7 (1996)

Journal:

Microelectronics Reliability

Year:

1997

Language:

english

File:

PDF, 140 KB

english, 1997

26

Electron and proton irradiation-induced degradation of epitaxial InP solar cells : R. J. Walters et al. Solid-State Electronics, 39 (6), 797 (1996)

Journal:

Microelectronics Reliability

Year:

1997

Language:

english

File:

PDF, 148 KB

english, 1997

27

The appropriateness of plastic encapsulated microcircuits in a specific wooden-round application : John R. Gardner. IEEE Transactions on Reliability, 45 (1), 10 (1996)

Journal:

Microelectronics Reliability

Year:

1997

Language:

english

File:

PDF, 148 KB

english, 1997

28

Plastic-encapsulated microcircuit reliability and cost-effectiveness study : Douglas Emerson, Edward Hakim and Anand Govind. IEEE Transactions on Reliability, 45 (1), 19 (1996)

Journal:

Microelectronics Reliability

Year:

1997

Language:

english

File:

PDF, 290 KB

english, 1997

29

Effortless incremental design FMEA : Christopher J. Price. 1996 Proceedings of the Annual Reliability and Maintainability Symposium, 43 (1996)

Journal:

Microelectronics Reliability

Year:

1997

Language:

english

File:

PDF, 140 KB

english, 1997

30

A combined analysis approach to assessing requirements for safety critical real-time control systems : Peter L. Goddard. 1996 Proceedings of the Annual Reliability and Maintainability Symposium, 110 (1996)

Journal:

Microelectronics Reliability

Year:

1997

Language:

english

File:

PDF, 140 KB

english, 1997

31

Fault tree models for the analysis of complex computer-based systems : Laura L. Pullum and Joanne Bechta Dugan. 1996 Proceedings of the Annual Reliability and Maintainability Symposium, 200 (1996)

Journal:

Microelectronics Reliability

Year:

1997

Language:

english

File:

PDF, 140 KB

english, 1997

32

Computational method for reliability data analysis : Gordon Johnston. 1996 Proceedings of the Annual Reliability and Maintainability Symposium, 287 (1996)

Journal:

Microelectronics Reliability

Year:

1997

Language:

english

File:

PDF, 140 KB

english, 1997

33

Worst case circuit analysis—an overview (electronic parts/circuits tolerance analysis) : Walter M. Smith. 1996 Proceedings of the Annual Reliability and Maintainability Symposium, 326 (1996)

Journal:

Microelectronics Reliability

Year:

1997

Language:

english

File:

PDF, 140 KB

english, 1997

34

Designing for fault-tolerance in the commercial environment : M. N. Karyagina. 1996 Proceedings of the Annual Reliability and Maintainability Symposium, 258 (1996)

Journal:

Microelectronics Reliability

Year:

1997

Language:

english

File:

PDF, 137 KB

english, 1997

35

Accelerated life testing for products without sequence effect : Zigmund Bluvband et al. 1995 Proceedings of the Annual Reliability and Maintainability Symposium, 341 (1995

Journal:

Microelectronics Reliability

Year:

1997

Language:

english

File:

PDF, 137 KB

english, 1997

36

Development of a fault isolation procedure : Lemuel L. Means. 1996 Proceedings of the Annual Reliability and Maintainability Symposium, 97 (1996)

Journal:

Microelectronics Reliability

Year:

1997

Language:

english

File:

PDF, 137 KB

english, 1997

37

Consideration of node failures in network-reliability calculation : Victor A. Netes and Boris P. Filin. IEEE Transactions on Reliability, 45 (1), 127 (1996)

Journal:

Microelectronics Reliability

Year:

1997

Language:

english

File:

PDF, 137 KB

english, 1997

38

Modified ‘Practical Bayes-Estimators’ : Pasquale Erto and Massimiliano Giorgio. IEEE Transactions on Reliability, 45 (1), 132 (1996)

Journal:

Microelectronics Reliability

Year:

1997

Language:

english

File:

PDF, 138 KB

english, 1997

39

The failure of Bayes system reliability inference based on data with multi-level applicability : Lloyd L. Philipson. IEEE Transactions on Reliability, 45 (1), 66 (1996)

Journal:

Microelectronics Reliability

Year:

1997

Language:

english

File:

PDF, 138 KB

english, 1997

40

Hypothesis-test for reliability in a stress-strength model, with prior information : S. B. Nandi and A. B. Aich. IEEE Transactions on Reliability, 45 (1), 129 (1996)

Journal:

Microelectronics Reliability

Year:

1997

Language:

english

File:

PDF, 138 KB

english, 1997

41

A recursive variance-reduction algorithm for estimating communication-network reliability : IEEE Transactions on Reliability, 44 (4), 595 (1995)

Journal:

Microelectronics Reliability

Year:

1997

Language:

english

File:

PDF, 138 KB

english, 1997

42

Optimal algorithms for synthesis of reliable application-specific heterogeneous multiprocessors : Autobindo Dasgupta and Ramesh Karri. IEEE Transactions on Reliability, 44 (4), 603 (1995)

Journal:

Microelectronics Reliability

Year:

1997

Language:

english

File:

PDF, 281 KB

english, 1997

43

Component redundancy vs system redundancy in the hazard rate ordering : Philip J. Boland and Emad-el-Neweihi. IEEE Transactions on Reliability, 44 (4), 614 (1995)

Journal:

Microelectronics Reliability

Year:

1997

Language:

english

File:

PDF, 146 KB

english, 1997

44

The use of imprecise component reliability distributions in reliability calculations : Ian D. Roberts and Andrew E. Samuel. IEEE Transactions on Reliability, 45 (1), 141 (1996)

Journal:

Microelectronics Reliability

Year:

1997

Language:

english

File:

PDF, 146 KB

english, 1997

45

Mean time to first failure of repairable systems with one cold spare : Winfrid G. Schneeweiss. IEEE Transactions on Reliability, 44 (4), 567 (1995)

Journal:

Microelectronics Reliability

Year:

1997

Language:

english

File:

PDF, 290 KB

english, 1997

46

Determining the discrete-time reliability of a repairable 2-out-of-(N + 1): F system : Kipp L. Bruning. IEEE Transactions on Reliability, 45 (1), 150 (1996)

Journal:

Microelectronics Reliability

Year:

1997

Language:

english

File:

PDF, 145 KB

english, 1997

47

An input-domain based method to estimate software reliability : Alberto Pasquini, Elio de Agostino and Guiseppe di Marco. IEEE Transactions on Reliability, 45 (1), 95 (1996)

Journal:

Microelectronics Reliability

Year:

1997

Language:

english

File:

PDF, 285 KB

english, 1997

48

Tutorial: temperature as an input to microelectronics-reliability models : Pradeep Lall. IEEE Transactions on Reliability, 45 (1), 3 (1996)

Journal:

Microelectronics Reliability

Year:

1997

Language:

english

File:

PDF, 145 KB

english, 1997

49

How to model reliability-growth when times of design modifications are known : Nader Ebrahimi. IEEE Transactions on Reliability, 45 (1), 54 (1996)

Journal:

Microelectronics Reliability

Year:

1997

Language:

english

File:

PDF, 145 KB

english, 1997

50

Solving ML equations for 2-parameter Poisson-process models for ungrouped software-failure data : George J. Knafl and Joseph Morgan. IEEE Transactions on Reliability, 45 (1), 42 (1996)

Journal:

Microelectronics Reliability

Year:

1997

Language:

english

File:

PDF, 145 KB

english, 1997

51

A cost comparison of new MCM technologies : A. T. Singer. Circuit World, 22 (2), 5 (1996)

Journal:

Microelectronics Reliability

Year:

1997

Language:

english

File:

PDF, 133 KB

english, 1997

52

Reliability investigations of fluxless flip chip inter-connections on green tape ceramic substrates : Joachim Kloeser, Elke Zakel, Franz Bechtold and Herbert Reichl. IEEE Transactions on Components, Packaging, and Manufacturing Technology—Part A, 19 (1) 24 (1996)

Journal:

Microelectronics Reliability

Year:

1997

Language:

english

File:

PDF, 133 KB

english, 1997

53

Modelling and simulation of a satellite constellation based on petri nets : Jean-Francois Ereau and Malecka Saleman. 1996 Proceedings of the Annual Reliability and Maintainability Symposium, 66 (1996)

Journal:

Microelectronics Reliability

Year:

1997

Language:

english

File:

PDF, 133 KB

english, 1997

54

Prospects for terahertz technology : C. M. Snowden. Electronics and Communications Engineering Journal, 51 (1996)

Journal:

Microelectronics Reliability

Year:

1997

Language:

english

File:

PDF, 133 KB

english, 1997

55

The contamination audit—a vital tool for yield improvement : S. Hamilton. Circuit World, 22 (3), 23 (1996)

Journal:

Microelectronics Reliability

Year:

1997

Language:

english

File:

PDF, 133 KB

english, 1997

56

Semiconductor lithography for the next millennium : Linda Geppert. IEEE Spectrum, 33 (1996)

Journal:

Microelectronics Reliability

Year:

1997

Language:

english

File:

PDF, 133 KB

english, 1997

57

Temperature and stress time history responses in electronic packaging : John H. Lau. IEEE Transactions on Components, Packaging and Manufacturing Technology—Part B, 19 (1), 248 (1996)

Journal:

Microelectronics Reliability

Year:

1997

Language:

english

File:

PDF, 146 KB

english, 1997

58

Use of BCB in high frequency MCM interconnects : Vikram B. Krishnamurthy, H. S. Cole and T. Sitnik-Nieters. IEEE Transactions on Components, Packaging and Manufacturing Technology—Part B, 19 (1), 42 (1996)

Journal:

Microelectronics Reliability

Year:

1997

Language:

english

File:

PDF, 146 KB

english, 1997

59

Development of an inspection process for ball-grid-array technology using scanned-beam X-ray laminography : S. M. Rooks, B. Benhabib and K. C. Smith. IEEE Transactions on Components, Packaging and Manufacturing Technology—Part A, 18 (4), 851 (1995)

Journal:

Microelectronics Reliability

Year:

1997

Language:

english

File:

PDF, 146 KB

english, 1997

60

Optimum design and selection of heat sinks : Seri Lee. IEEE Transactions on Components, Packaging and Manufacturing Technology—Part A, 18 (4), 812 (1995)

Journal:

Microelectronics Reliability

Year:

1997

Language:

english

File:

PDF, 146 KB

english, 1997

61

A new bonding technique for microwave devices : G. Rainer Dohle, John J. Callahan, Kevin P. Martin and Timothy J. Drabik. IEEE Transactions on Components, Packaging and Manufacturing Technology—Part B, 19 (1), 57 (1996)

Journal:

Microelectronics Reliability

Year:

1997

Language:

english

File:

PDF, 283 KB

english, 1997

62

The evolution of IBM high performance cooling technology : Robert E. Simons. IEEE Transactions on Components, Packaging and Manufacturing Technology—Part A, 18 (4), 805 (1995)

Journal:

Microelectronics Reliability

Year:

1997

Language:

english

File:

PDF, 144 KB

english, 1997

63

Multichannel optical modules compatible with the fiber-in-board technology : Geert de Pestel et al. IEEE Transactions on Components, Packaging and Manufacturing Technology—Part B, 19 (1), 116 (1996)

Journal:

Microelectronics Reliability

Year:

1997

Language:

english

File:

PDF, 144 KB

english, 1997

64

Avalanche breakdown of high-voltage p-n junctions of SiC : L. Pelaz et al. Microelectronics Journal, 27 (1), 43 (1996)

Journal:

Microelectronics Reliability

Year:

1997

Language:

english

File:

PDF, 146 KB

english, 1997

65

SPICE-models for high-pincount board connectors : Helmut Katzier, Renate Reischl and Peter Pagnin. IEEE Transactions on Components, Packaging and Manufacturing Technology—Part B, 19 (1), 3 (1996)

Journal:

Microelectronics Reliability

Year:

1997

Language:

english

File:

PDF, 144 KB

english, 1997

66

Achieving accurate thermal characterization using a CFD code—a case study of plastic packages : Juan Burgos, Vincent P. Manno and Kaveh Azar. IEEE Transactions on Components, Packaging and Manufacturing Technology—Part A, 18 (4), 732 (1995)

Journal:

Microelectronics Reliability

Year:

1997

Language:

english

File:

PDF, 278 KB

english, 1997

67

Structured test methodologies and test economics for multichip modules : IEEE Transactions on Components, Packaging and Manufacturing Technology—Part B, 19 (1), 195 (1996)

Journal:

Microelectronics Reliability

Year:

1997

Language:

english

File:

PDF, 140 KB

english, 1997

68

An assessment of the thermal performance of the PBGA family : Saailesh Mulgaonker et al. IEEE Transactions on Components, Packaging and Manufacturing Technology—Part A, 18 (4), 739 (1995)

Journal:

Microelectronics Reliability

Year:

1997

Language:

english

File:

PDF, 140 KB

english, 1997

69

Experimental investigation of subcooled liquid nitrogen impingement cooling of a silicon chip : David T. Vader, Gregory M. Chrysler, Richard C. Chu and Robert E. Simons. IEEE Transactions on Components, Packaging and Manufacturing Technology—Part A, 18 (4), 788 (1995)

Journal:

Microelectronics Reliability

Year:

1997

Language:

english

File:

PDF, 140 KB

english, 1997

70

Asymptotic thermal analysis of electronic packages and printed-circuit boards : Da-Guang Liu et al. IEEE Transactions on Components, Packaging and Manufacturing Technology—Part A, 18 (4), 781 (1995)

Journal:

Microelectronics Reliability

Year:

1997

Language:

english

File:

PDF, 140 KB

english, 1997

71

System design methodologies: aiming at the 100 h design cycle : Daniel D. Gajski et al. IEEE Transactions on Very Large Scale Integration (VLSI) Systems, 4 (1), 70 (1996)

Journal:

Microelectronics Reliability

Year:

1997

Language:

english

File:

PDF, 145 KB

english, 1997

72

Thermal characterization of electronic devices with boundary condition independent compact models : Clemens J. M. Lasance, Heinz Vinke and Harvey Rosten. IEEE Transactions on Components, Packaging and Manufacturing Technology—Part A, 18 (4), 723 (1995)

Journal:

Microelectronics Reliability

Year:

1997

Language:

english

File:

PDF, 145 KB

english, 1997

73

Accelerated testing for cosmic soft-error rate : J. F. Ziegler et al. IBM J. Res. Develop., 40 (1), 51 (1996)

Journal:

Microelectronics Reliability

Year:

1997

Language:

english

File:

PDF, 145 KB

english, 1997

74

A CMOS IC for Gb/s Viterbi decoding: system design and VLSI implementation : Herbert Dawid, Gerhard Fetiweis and Heinrich Keyr. IEEE Transactions on Very Large Scale Integration (VLSI) Systems, 4 (1), 17 (1996)

Journal:

Microelectronics Reliability

Year:

1997

Language:

english

File:

PDF, 286 KB

english, 1997

75

Intersubband lifetimes in Si/SiGe quantum wells : W. Heiss et al. Solid-State Electronics, 40 (1–8), 59 (1996)

Journal:

Microelectronics Reliability

Year:

1997

Language:

english

File:

PDF, 144 KB

english, 1997

76

Design and evaluation of an epoxy three-dimensional multichip module : Jon M. Stern et al. IEEE Transactions on Components, Packaging and Manufacturing Technology—Part B, 19 (1), 188 (1996)

Journal:

Microelectronics Reliability

Year:

1997

Language:

english

File:

PDF, 144 KB

english, 1997

77

Investigation of low power all-optical bistability in an InGaAsInAlAs superlattice : J. Courturier, J. C. Harmand and P. Voisin. Solid-State Electronics, 40 (1–8), 453 (1996)

Journal:

Microelectronics Reliability

Year:

1997

Language:

english

File:

PDF, 144 KB

english, 1997

78

Compact non-local modelling of impact ionization in SOI MOSFETs for optimal CMOS device/circuit design : S. Krishnan and J. G. Fossum. Solid-State Electronics, 39 (5), 661 (1996)

Journal:

Microelectronics Reliability

Year:

1997

Language:

english

File:

PDF, 144 KB

english, 1997

79

New complementary BiCMOS digital gates for low-voltage environments : S. S. Rofail and Yeu Kiat Seng. Solid-State Electronics, 39 (5), 681 (1996)

Journal:

Microelectronics Reliability

Year:

1997

Language:

english

File:

PDF, 278 KB

english, 1997

80

The conduction properties of the silicon/off-stoichiometry-SiO2 diode : M. Aceves, C. Falcony, A. Reynoso-Hernandez, W. Calleja and A. Torres. Solid-State Electronics, 39 (5), 637 (1996)

Journal:

Microelectronics Reliability

Year:

1997

Language:

english

File:

PDF, 140 KB

english, 1997

81

Effect of GE incorporation on the performance of P-channel polycrystalline Si1−xGex thin-film transistors : H. C. Lin, H. Y. Lin and C. Y. Chang. Solid-State Electronics, 39 (5), 645 (1996)

Journal:

Microelectronics Reliability

Year:

1997

Language:

english

File:

PDF, 140 KB

english, 1997

82

Interplay of 2D and 3D charge carriers in Si-δ-doped InSb layers grown epitaxially on GaAs : A. De Keyser et al. Solid-State Electronics, 40 (1–8), 395 (1996)

Journal:

Microelectronics Reliability

Year:

1997

Language:

english

File:

PDF, 140 KB

english, 1997

83

Quantum functional devices for advanced electronics : N. Yokoyama et al. Solid-State Electronics, 40 (1–8), 505 (1996)

Journal:

Microelectronics Reliability

Year:

1997

Language:

english

File:

PDF, 140 KB

english, 1997

84

Atomic force microscopy studies of SiGe films and Si/SiGe heterostructures : M. A. Lutz, R. M. Feenstra and J. O. Chu. IBM J. Res. Develop., 39 (6), 629 (1995)

Journal:

Microelectronics Reliability

Year:

1997

Language:

english

File:

PDF, 143 KB

english, 1997

85

Polarization-sensitive photocurrents of metal-semiconductor structures with flat and microrelief interfaces : N. L. Dmitruk et al. Microelectronics Journal, 27, 37 (1996)

Journal:

Microelectronics Reliability

Year:

1997

Language:

english

File:

PDF, 143 KB

english, 1997

86

A study of composite Bi2O3, In2O3 and RuO2 planar thick film piezoresistive gauges : D. G. Collins and K. I. Arshak. Microelectronics Journal, 27, 59 (1996)

Journal:

Microelectronics Reliability

Year:

1997

Language:

english

File:

PDF, 143 KB

english, 1997

87

Discrimination of individual gases/odours using polar plot of an integrated thick film sensor array : V. K. Singh, R. Dwivedi and S. K. Srivastava. Microelectronics Journal, 27, 531 (1996)

Journal:

Microelectronics Reliability

Year:

1997

Language:

english

File:

PDF, 143 KB

english, 1997

88

Hybrid assembly: a strategy for expanding the role of ‘advanced’ assembly technology : Paul S. Wu, H. Y. Tam and Patri K. Venuvinjod. Computers Elect. Engng. 22 (2), 109 (1996)

Journal:

Microelectronics Reliability

Year:

1997

Language:

english

File:

PDF, 283 KB

english, 1997

89

Thin-film multimaterial optoelectronic integrated circuits : Nan Marie Jokerst et al. IEEE Transactions on Components, Packaging and Manufacturing Technology—Part B, 19 (1), 97 (1996)

Journal:

Microelectronics Reliability

Year:

1997

Language:

english

File:

PDF, 144 KB

english, 1997

90

High speed laser ablation of microvia holes in non-woven Aramid reinforced printed wiring boards to reduce cost : M. Weihold and D. J. Powell. Circuit World, 22 (3), 16 (1996)

Journal:

Microelectronics Reliability

Year:

1997

Language:

english

File:

PDF, 281 KB

english, 1997

91

Focused ion beam preparation of inclined planes in semiconductor materials : B. Khamsehpour and S. T. Davies. Vacuum, 47 (5), 451 (1996)

Journal:

Microelectronics Reliability

Year:

1997

Language:

english

File:

PDF, 142 KB

english, 1997

92

Modelling effects of focused ion beams : F. Stern, S. E. Laux and A. Kumar. Solid-state Electronics, 40 (1–8), 523 (1996)

Journal:

Microelectronics Reliability

Year:

1997

Language:

english

File:

PDF, 142 KB

english, 1997

93

Focused beam machining and deposition for nanofabrication S. T. Davies and B. Khamsehpour. Vacuum, 47 (5), 455 (1996)

Journal:

Microelectronics Reliability

Year:

1997

Language:

english

File:

PDF, 142 KB

english, 1997

94

Submicro- and nanometer structure fabricating using direct electron-beam writing and reactive ion etching : P. Hudek et al. Electron Technology, 28 (4), 251 (1995)

Journal:

Microelectronics Reliability

Year:

1997

Language:

english

File:

PDF, 142 KB

english, 1997

95

Lateral electron depletion in focused-ion-beam implanted pseudomorphic heterostructures with InxGa1−xAs channels : D. K. De Vries, H. Kunzel, K. Hausler, K. H. Ploog and A. D. Wieck Solid-State Electronics, 40 (1–8), 637 (1996)

Journal:

Microelectronics Reliability

Year:

1997

Language:

english

File:

PDF, 247 KB

english, 1997

96

Strong magnetic field dependence of laser emission from quantum wires formed by cleaved edge overgrowth : W. Wegschneider et al. Solid-State Electronics, 40 (1–8), 1 (1996)

Journal:

Microelectronics Reliability

Year:

1997

Language:

english

File:

PDF, 110 KB

english, 1997

97

A methodology for laser-based thermal diffusivity measurement of advanced multichip module ceramic materials : L. Kehoe, P. V. Kelly, G. M. O'Connar, M. O'Reilly and G. M. Crean. IEE Transactions on Components, Packaging and Manufacturing Technology—Part A, 18 (4), 773 (1995)

Journal:

Microelectronics Reliability

Year:

1997

Language:

english

File:

PDF, 110 KB

english, 1997

98

Growth of CuGaSe2 film by molecular beam epitaxy : Akimasa Yamada et al. Microelectronics Journal, 27, 53 (1996)

Journal:

Microelectronics Reliability

Year:

1997

Language:

english

File:

PDF, 110 KB

english, 1997

99

Reliability analysis and comparison of several structures

Jae-Hak Lim, Jai-Sang Koh

Journal:

Microelectronics Reliability

Year:

1997

Language:

english

File:

PDF, 533 KB

english, 1997

100

Analysis of a two-unit warm standby system subject to degradation

G.S. Mokaddis, S.W. Labib, A.M. Ahmed

Journal:

Microelectronics Reliability

Year:

1997

Language:

english

File:

PDF, 563 KB

english, 1997

101

An optimal maintenance model using a number of different actions

Journal:

Microelectronics Reliability

Year:

1997

Language:

english

File:

PDF, 740 KB

english, 1997

102

System reliability with common-cause hazard to obey an exponential power model

M.A. El-Damcese

Journal:

Microelectronics Reliability

Year:

1997

Language:

english

File:

PDF, 309 KB

english, 1997

103

Genetics based redudancy optimization

V. Ramachandran, V. Sivakumar, K. Sathiyanarayanan, S. Chandrasekaran

Journal:

Microelectronics Reliability

Year:

1997

Language:

english

File:

PDF, 245 KB

english, 1997

104

Technical note

V. Ramachandran, J. Kannan, K. Sathiyanarayanan, V. Sivakumar

Journal:

Microelectronics Reliability

Year:

1997

Language:

english

File:

PDF, 245 KB

english, 1997

105

Things are changing A report on the reliability and maintainability symposium 1996

Journal:

Microelectronics Reliability

Year:

1997

Language:

english

File:

PDF, 156 KB

english, 1997

106

Planning and optimizing environmental stress screening : Y. L. Mok and M. Xie. 1996 Proceedings of the Annual Reliability and Maintainability Symposium, 191 (1996)

Journal:

Microelectronics Reliability

Year:

1997

Language:

english

File:

PDF, 122 KB

english, 1997

107

Dependability standards: an international perspective : Claudio Benski. 1996 Proceedings of the Annual Reliability and Maintainability Symposium, 13 (1996)

Journal:

Microelectronics Reliability

Year:

1997

Language:

english

File:

PDF, 122 KB

english, 1997

108

Some remarks on rare-event approximation : Jerome Collet. IEEE Transactions on Reliability, 45 (1), 106 (1996)

Journal:

Microelectronics Reliability

Year:

1997

Language:

english

File:

PDF, 122 KB

english, 1997

109

Using polymer thick film for cost-effective EMC protection on PCBs for automotive applications : M. A. Saltzberg, A. L. Neller, C. S. Harvey, T. E. Borninski and R. J. Gordon. Circuit World, 22 (3), 67 (1996)

Journal:

Microelectronics Reliability

Year:

1997

Language:

english

File:

PDF, 276 KB

english, 1997

110

Field-based analysis of a high pincount board connector : Heike Wolter et al. IEEE Transactions on Components, Packaging and Manufacturing Technology — Part B, 19 (1), 23 (1996)

Journal:

Microelectronics Reliability

Year:

1997

Language:

english

File:

PDF, 140 KB

english, 1997

111

Degradation of gold-aluminium ball bonds by aging and contamination : V. Koeninger, H. H. Uchida and E. Fromm. IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part A, 18 (4), 835 (1995)

Journal:

Microelectronics Reliability

Year:

1997

Language:

english

File:

PDF, 140 KB

english, 1997

112

Reliability assessment of fielded plastic and hermetically packaged microelectronics : Bruce Johnson and Vani Verma. IEEE Transactions on Reliability, 45 (1), 23 (1996)

Journal:

Microelectronics Reliability

Year:

1997

Language:

english

File:

PDF, 148 KB

english, 1997

113

Comparing the importance of system components by some structural characteristics : Fan C. Meng. IEEE Transactions on Reliability, 45 (1) 59 (1996)

Journal:

Microelectronics Reliability

Year:

1997

Language:

english

File:

PDF, 146 KB

english, 1997

114

Modelling the cosmic-ray-induced soft-error rate in integrated circuits: an overview : G. R. Srinivasan. IBM J. Res. Develop., 40 (1), 77 (1996)

Journal:

Microelectronics Reliability

Year:

1997

Language:

english

File:

PDF, 146 KB

english, 1997

115

Fuzzy reliability using a discrete stress-strength interference model : J. D. Wang and T. S. Liu. IEEE Transactions on Reliability, 45 (1), 145 (1996)

Journal:

Microelectronics Reliability

Year:

1997

Language:

english

File:

PDF, 282 KB

english, 1997

116

Transformations of Star-Delta and Delta-Star reliability networks : Sheng-De Wang and Cha-Hon Sun. IEEE Transactions on Reliability, 45 (1), 120 (1996)

Journal:

Microelectronics Reliability

Year:

1997

Language:

english

File:

PDF, 137 KB

english, 1997

117

Modified block-replacement for multiple-component systems : Thomas W. Archibald and Rommert Dekker. IEEE Transactions on Reliability, 45 (1), 75 (1996)

Journal:

Microelectronics Reliability

Year:

1997

Language:

english

File:

PDF, 271 KB

english, 1997

118

Robust parameter-estimation using the bootstrap method for the 2-parameter Weibull distribution : Tetsurou Seki and Shin-Ichiro Yokoyama. IEEE Transactions on Reliability, 45 (1), 34 (1996)

Journal:

Microelectronics Reliability

Year:

1997

Language:

english

File:

PDF, 146 KB

english, 1997

119

Comment on: reliability modelling and performance of variable link-capacity networks : R. Schanzer. IEEE Transactions on Reliability, 44 (4), 620 (1995)

Journal:

Microelectronics Reliability

Year:

1997

Language:

english

File:

PDF, 146 KB

english, 1997

120

Safety assessment, reliability, and the Probability-Operation diagram : Antony G. Vassakis. IEEE Transactions on Reliability, 45 (1), 90 (1996)

Journal:

Microelectronics Reliability

Year:

1997

Language:

english

File:

PDF, 146 KB

english, 1997

121

Lower and upper bounds for the reliability of connected-(r,s)-out-of-(m,n): F lattice systems : Jacek Malinowski and Wolfgang Preuss. IEEE Transactions on Reliability, 45 (1), 156 (1996)

Journal:

Microelectronics Reliability

Year:

1997

Language:

english

File:

PDF, 145 KB

english, 1997

122

A unified domination approach for reliability analysis of networks with arbitrary logic in vertices : Arkadi A. Chernyak and Zhanna A. Chernyak. IEEE Transactions on Reliability, 45 (1), 114 (1996)

Journal:

Microelectronics Reliability

Year:

1997

Language:

english

File:

PDF, 145 KB

english, 1997

123

Analysis of step-stress accelerated-life-test data: a new approach : L. C. Tang, Y. S. Sun, T. N. Goh and H. L. Ong. IEEE Transactions on Reliability, 45 (1), 69 (1996)

Journal:

Microelectronics Reliability

Year:

1997

Language:

english

File:

PDF, 145 KB

english, 1997

124

A comparison of fault-tolerant state machine architectures for space-borne electronics : Shailesh Niranjan and James F. Frenzel. IEEE Transactions on Reliability, 45 (1), 109 (1996)

Journal:

Microelectronics Reliability

Year:

1997

Language:

english

File:

PDF, 145 KB

english, 1997

125

Dynamic analysis of qualitative circuits for failure mode and effects analysis : David R. Pugh and Neal Snooke. 1996 Proceedings of the Annual Reliability and Maintainability Symposium, 37 (1996)

Journal:

Microelectronics Reliability

Year:

1997

Language:

english

File:

PDF, 272 KB

english, 1997

126

Optoelectronic packaging of two-dimensional surface active devices : Nagesh R. Basavanhally, Michael F. Brady and D. Bruce Buchholz. IEEE Transactions on Components, Packaging and Manufacturing Technology—Part B, 19 (1), 107 (1996)

Journal:

Microelectronics Reliability

Year:

1997

Language:

english

File:

PDF, 146 KB

english, 1997

127

Time-domain characterization and circuit modelling of a multilayer ceramic package : Jyh-Ming Jong, Bozidar Janko and Vijai K. Tripathi. IEEE Transactions on Components, Packaging and Manufacturing Technology—Part B, 19 (1), 48 (1996)

Journal:

Microelectronics Reliability

Year:

1997

Language:

english

File:

PDF, 146 KB

english, 1997

128

A rigorous method to evaluate the electrical performance of MCM interconnections in frequency and time domains : Rachid Salik, Jun-Wu Tao, Gilbert Angenieux and Bernard Flechet. IEEE Transactions on Components, Packaging and Manufacturing Technology—Part B, 19 (1), 74 (1996)

Journal:

Microelectronics Reliability

Year:

1997

Language:

english

File:

PDF, 144 KB

english, 1997

129

Fine line thin dielectric circuit board characterization : Chi Shih Chang and Amit P. Agrawal. IEEE Transactions on Components, Packaging and Manufacturing Technology—Part A, 18 (4), 842 (1995)

Journal:

Microelectronics Reliability

Year:

1997

Language:

english

File:

PDF, 145 KB

english, 1997

130

A hi-density C4/CBGA interconnect technology for a CMOS microprocessor : Gary B. Kromann, R. David Gerke and Wayne Wei-Xu Huang. IEEE Transactions on Components, Packaging and Manufacturing Technology—Part B, 19 (1), 166 (1996)

Journal:

Microelectronics Reliability

Year:

1997

Language:

english

File:

PDF, 144 KB

english, 1997

131

Case study: the design of a mixed-signal global positioning system receiver using multichip module packaging : Patrick J. Zabinski et al. IEEE Transactions on Components, Packaging and Manufacturing Technology—Part B, 19 (1), 215 (1996)

Journal:

Microelectronics Reliability

Year:

1997

Language:

english

File:

PDF, 144 KB

english, 1997

132

Effects of the rear interface states and fixed charges on the electrical characteristics of thin film transistors with thin amorphous silicon layers : Ya-Hsiang Tai et al. Solid-State Electronics, 39 (6), 901 (1996)

Journal:

Microelectronics Reliability

Year:

1997

Language:

english

File:

PDF, 144 KB

english, 1997

133

Damage to substrates during SiO2 etching: opportunities of subsequent removal by optimized cleaning procedures : H. H. Richter, A. Wolff, K. Blum, K. Hoeppner, D. Kruger and R. Sorge. Vacuum, 47 (5), 437 (1996)

Journal:

Microelectronics Reliability

Year:

1997

Language:

english

File:

PDF, 144 KB

english, 1997

134

A novel two-step etching process for reducing plasma-induced oxide damage : Kuo-Feng You and Ching-Yuan Wu. Solid-State Electronics, 39 (5), 689 (1996)

Journal:

Microelectronics Reliability

Year:

1997

Language:

english

File:

PDF, 144 KB

english, 1997

135

Level crossing of nanometer size InAs islands in GaAs : B. Kowalski, P. Omling, M. S. Miller, S. Jeppesen and L. Samuelson. Solid-State Electronics, 40 (1–8), 367 (1996)

Journal:

Microelectronics Reliability

Year:

1997

Language:

english

File:

PDF, 140 KB

english, 1997

136

Annealing effect of vacuum evaporated InSb thin films : Masahiro Tomisu, Narumi Inouse and Yoshizumi Yasuoka. Vacuum, 47 (3), 239 (1996)

Journal:

Microelectronics Reliability

Year:

1997

Language:

english

File:

PDF, 279 KB

english, 1997

137

Correlation of the decay of tunneling currents with trap generation inside thin oxides : N. A. Dumin, K. J. Dickerson, D. J. Dumin and B. T. Moore. Solid-State Electronics, 39 (5), 655 (1996)

Journal:

Microelectronics Reliability

Year:

1997

Language:

english

File:

PDF, 143 KB

english, 1997

138

Growth and characterization of HTSC thin films for microelectronics devices : A. Perrin et al. Microelectronics Journal, 27, 343 (1996)

Journal:

Microelectronics Reliability

Year:

1997

Language:

english

File:

PDF, 144 KB

english, 1997

139

New optical and electrical hybrid packaging techniques using optical waveguides for optoelectronic multichip modules : Shinji Koike, Fusao Shimokawa, Tohru Matsurra and Hideyuki Takahara. IEEE Transactions on Components, Packaging and Manufacturing Technology—Part B, 19 (1), 124 (1996)

Journal:

Microelectronics Reliability

Year:

1997

Language:

english

File:

PDF, 144 KB

english, 1997

140

MBE growth physics: application to device technology : Marian A. Herman and Helmut Sitter. Microelectronics Journal, 27, 257 (1996)

Journal:

Microelectronics Reliability

Year:

1997

Language:

english

File:

PDF, 142 KB

english, 1997

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