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Reliability investigations of fluxless flip chip inter-connections on green tape ceramic substrates : Joachim Kloeser, Elke Zakel, Franz Bechtold and Herbert Reichl. IEEE Transactions on Components, Packaging, and Manufacturing Technology—Part A, 19 (1) 24 (1996)
Volume:
37
Year:
1997
Language:
english
DOI:
10.1016/s0026-2714(97)87705-0
File:
PDF, 133 KB
english, 1997