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Asymptotic thermal analysis of electronic packages and printed-circuit boards : Da-Guang Liu et al. IEEE Transactions on Components, Packaging and Manufacturing Technology—Part A, 18 (4), 781 (1995)
Volume:
37
Year:
1997
Language:
english
DOI:
10.1016/s0026-2714(97)87726-8
File:
PDF, 140 KB
english, 1997