Design and evaluation of an epoxy three-dimensional multichip module : Jon M. Stern et al. IEEE Transactions on Components, Packaging and Manufacturing Technology—Part B, 19 (1), 188 (1996)
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Volume:
37
Year:
1997
Language:
english
DOI:
10.1016/s0026-2714(97)87735-9
File:
PDF, 144 KB
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english, 1997
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