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Analysis of thermomechanical stresses in a 3D packaged micro electro mechanical system
C. Pellet, M. Lecouvé, H. Frémont, A. Val, D. EstèveVolume:
38
Year:
1998
Language:
english
Pages:
4
DOI:
10.1016/s0026-2714(98)00103-6
File:
PDF, 299 KB
english, 1998