Mechanical stress evolution and the blech length: 2D...

Microelectronics Reliability 1998 Vol. 38; Iss. 6-8

Mechanical stress evolution and the blech length: 2D simulation of early electromigration effects

V. Petrescu, A.J. Mouthaan, W. Schoenmaker, C. Salm
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Volume:
38
Year:
1998
Language:
english
Pages:
4
DOI:
10.1016/s0026-2714(98)00105-x
File:
PDF, 243 KB
english, 1998
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