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Structures for piezoresistive measurement of package induced stress in transfer molded silicon pressure sensors
J.B. Nysæther, A. Larsen, B. Liverød, P. OhlckersVolume:
38
Year:
1998
Language:
english
Pages:
6
DOI:
10.1016/s0026-2714(98)00146-2
File:
PDF, 473 KB
english, 1998