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The evolution of the resistance of aluminum interconnects during electromigration
Jonathan C. Doan, John C. Bravman, Paul A. Flinn, Thomas N. MariebVolume:
40
Year:
2000
Language:
english
Pages:
10
DOI:
10.1016/s0026-2714(99)00340-6
File:
PDF, 577 KB
english, 2000