The creation of compact thermal models of electronic...

IEEE Transactions on Advanced Packaging 2005 / 05 Vol. 28; Iss. 2

The creation of compact thermal models of electronic components using model reduction

Celo, D., Xiaoming Guo,, Gunupudi, P.K., Khazaka, R., Walkey, D.J., Smy, T., Nakhla, M.S.
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Volume:
28
Language:
english
Journal:
IEEE Transactions on Advanced Packaging
DOI:
10.1109/TADVP.2005.846942
Date:
May, 2005
File:
PDF, 1.05 MB
english, 2005
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