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A COMPARISON OF TRENCH FILLING MATERIALS FOR SUB-MICRON CMOS
BOLBOT, P. H., ROBERTS, M. C., MEDHURST, P. L.Volume:
49
Language:
english
Journal:
Le Journal de Physique Colloques
DOI:
10.1051/jphyscol:19884112
Date:
September, 1988
File:
PDF, 988 KB
english, 1988