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Thermal design of ceramic packages for high power light-emitting diodes
Yang, Lianqiao, Hu, Jianzheng, Jang, Sunho, Shin, Moo WhanVolume:
22
Language:
english
Journal:
Semiconductor Science and Technology
DOI:
10.1088/0268-1242/22/7/005
Date:
July, 2007
File:
PDF, 361 KB
english, 2007