Changes in carrier profiles of bonded SOI wafers with...

Changes in carrier profiles of bonded SOI wafers with thermal annealing measured by the spreading resistance method

Masaya Ichimura, Shinya Ito, Eisuke Arai
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Volume:
46
Year:
2002
Language:
english
Pages:
9
DOI:
10.1016/s0038-1101(01)00263-5
File:
PDF, 254 KB
english, 2002
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