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Changes in carrier profiles of bonded SOI wafers with thermal annealing measured by the spreading resistance method
Masaya Ichimura, Shinya Ito, Eisuke AraiVolume:
46
Year:
2002
Language:
english
Pages:
9
DOI:
10.1016/s0038-1101(01)00263-5
File:
PDF, 254 KB
english, 2002