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Processing technology for the investigation of sub-50 nm copper damascene interconnects
G Steinlesberger, M Engelhardt, G Schindler, J Kretz, W Steinhögl, E BertagnolliVolume:
47
Year:
2003
Language:
english
Pages:
5
DOI:
10.1016/s0038-1101(03)00044-3
File:
PDF, 272 KB
english, 2003