Electromigration Study for Multiscale Power/Ground Vias in...

IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems 2014 / 12 Vol. 33; Iss. 12

Electromigration Study for Multiscale Power/Ground Vias in TSV-Based 3-D ICs

Pak, Jiwoo, Lim, Sung Kyu, Pan, David Z.
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Volume:
33
Language:
english
Journal:
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
DOI:
10.1109/tcad.2014.2360456
Date:
December, 2014
File:
PDF, 2.78 MB
english, 2014
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