3-D Probe: Low-Cost Variation Modeling Using Intertest-Item...

IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems 2014 / 12 Vol. 33; Iss. 12

3-D Probe: Low-Cost Variation Modeling Using Intertest-Item Correlations

Chung, Jaeyong, Kim, Yonghyun, Yang, Joon-Sung
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Volume:
33
Language:
english
Journal:
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
DOI:
10.1109/tcad.2014.2361629
Date:
December, 2014
File:
PDF, 562 KB
english, 2014
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