TiN Metal Hardmask Residue Removal Formulation Development for Advanced Porous Low-K and Cu Interconnect Application
Cui, HuaVolume:
219
Language:
english
Journal:
Solid State Phenomena
DOI:
10.4028/www.scientific.net/ssp.219.217
Date:
September, 2014
File:
PDF, 433 KB
english, 2014