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Evaluation of electroless deposited Co(W,P) thin films as diffusion barriers for copper metallization
A. Kohn, M. Eizenberg, Y. Shacham-Diamand, B. Israel, Y. SverdlovVolume:
55
Year:
2001
Language:
english
Pages:
7
DOI:
10.1016/s0167-9317(00)00460-3
File:
PDF, 231 KB
english, 2001