Reduced Cu interface diffusion by CoWP surface coating

Reduced Cu interface diffusion by CoWP surface coating

C.-K. Hu, L. Gignac, R. Rosenberg, E. Liniger, J. Rubino, C. Sambucetti, A. Stamper, A. Domenicucci, X. Chen
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Volume:
70
Year:
2003
Language:
english
Pages:
6
DOI:
10.1016/s0167-9317(03)00286-7
File:
PDF, 439 KB
english, 2003
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