Surface treatment of wire bonding metal pads

Microelectronic Engineering 2003 Vol. 70; Iss. 2-4

Surface treatment of wire bonding metal pads

S. Alberici, D. Coulon, P. Joubin, Y. Mignot, L. Oggioni, P. Petruzza, D. Piumi, L. Zanotti
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Volume:
70
Year:
2003
Language:
english
Pages:
8
DOI:
10.1016/s0167-9317(03)00418-0
File:
PDF, 686 KB
english, 2003
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