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Materials and processing for 0.25 μm multilevel interconnect
Mouloud Bakli, Laurence Baud, Hichem M'Saad, Didier Pique, Patrick RabinzohnVolume:
33
Year:
1997
Language:
english
Pages:
14
DOI:
10.1016/s0167-9317(96)00043-3
File:
PDF, 802 KB
english, 1997